The DS6602 FPGA Base Board, one of the two high-performance FPGA boards from dSPACE, is equipped with the latest FPGA technology to meet the strictest requirements in a wide range of applications, such as electric drive technology, hybrid vehicles, power electronics, and electric power engineering.
The DS6602 FPGA Base Board has been designed for applications that require very fast, high-resolution signal processing, for example:
With its very large and powerful FPGA, the DS6602 is the perfect candidate for hardware-in-the-loop (HIL) testing, which usually involves large simulation models.
The DS6602 is the new high-end FPGA board from dSPACE. It is equipped with the largest FPGA of the latest Xilinx® Kintex® UltraScale+TM FPGA generation. Its additional onboard RAM allows for storage of very large datasets, e.g., model parameter sets required for advanced electric drives simulation. The DS6602 features four multi-gigabit transceivers (MGT) that enable high-speed communication. To include more I/O channels, you can connect up to five I/O modules to each board. Additionally, you can connect multiple boards via inter-FPGA communication for direct data exchange between FPGA stacks.
Applications for the DS6602 FPGA are modeled with the AMD® Vitis TM Model Composer HDL Library, RTI FPGA Programming Blockset and the related dSPACE XSG-based solutions. If required, you can react flexibly to new requirements, such as new interfaces or having to accelerate the execution of submodels. You can also test the program in offline simulation before implementing it on the real-time hardware. Using dSPACE ConfigurationDesk, you can download the programs to the FPGA.
Three I/O modules are available for expanding the I/O channels of the dSPACE FPGA base boards: the DS2655M1 Multi-I/O Module, the DS2655M2 Digital I/O Module, and the DS6651 Multi-I/O Module. Up to five I/O modules can be connected to each FPGA base board, thus providing a flexible, customized channel set.
Parameter | DS6602 |
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General |
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FPGA |
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Additional onboard RAM |
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Angular Processing Units (APUs) |
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Number of connectors for I/O modules |
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Device timing |
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Internal communication interface |
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Physical size |
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Voltage supply |
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Typical power consumption |
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