MicroAutoBox II

Compact and robust prototyping system for in-vehicle applications

MicroAutoBox II is a real-time system for performing fast function prototyping. It can operate without user intervention, just like an ECU.

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  • Robust and compact design ideal for in-vehicle use
  • Comprehensive I/O including CAN, CAN FD, LIN, K-Line/L-Line, FlexRay, Ethernet, and bypass interfaces
  • Variants with Simulink®-programmable FPGA and Embedded PC (Windows/Linux)

Application Areas

MicroAutoBox II can be used for many different rapid control prototyping (RCP) applications such as powertrain, chassis control, body control, advanced driver assistance systems (ADAS), electric drives control, x-by-wire applications, and aerospace applications.
 

Key Benefits

The special strength of the MicroAutoBox II is its unique combination of high performance, comprehensive auto­motive I/O, and an extremely compact and robust design (extreme shock and vibration tests according to ISO 16750-3:2007). This lets you equip several vehicles or a whole test fleet to check the reliability of your control functions. In addition to the standard I/O, MicroAutoBox II offers variants with FPGA functionality for application-specific I/O extensions and for user-programmable FPGA applications. Moreover, there are MicroAutoBox II variants with inter­faces for all major auto­motive bus systems: CAN, CAN FD, LIN, K/L-Line, FlexRay, and Ethernet. As an option, an additional Embedded PC can be integrated into the MicroAutoBox II.


More Features

MicroAutoBox II can start up autonomously after power-up, with ECU-like boot-up times. A PC or notebook can be easily connected (hot-plugged) for application download, model parameterization, and data analysis via Ethernet. Application programs are stored in nonvolatile memory. MicroAutoBox II contains signal conditioning for automotive signal levels and an integrated flight recorder for long-term data acquisition (incl. support of USB mass storage devices).

Five Standard Variants
MicroAutoBox II is available in five standard variants, each with different interfaces and I/O functionalities. An ideal extension for the MicroAutoBox II is the RapidPro hardware with its off-the-shelf signal conditioning and power stage modules. All standard variants can integrate an additional Embedded PC.

 

Parameter Specification
MicroAutoBox II 1401/1507 1401/1511 1401/1513 1401/1511/1514 1401/1513/1514
Processor
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
  • IBM PPC 750GL, 900 MHz (incl. 1 MB level 2 cache)
Memory
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
  • 16 MB main memory
  • 6 MB memory exclusively for communication between MicroAutoBox and PC/notebook
  • 16 MB nonvolatile flash memory containing code section and flight data recorder
  • Clock/calendar function for time-stamping flight recorder data
Boot time
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
  • Depending on flash application size. Measurement examples:
    • 1 MB application: 160 ms
    • 3 MB application: 340 ms
Interfaces          

Host interface
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools
  • 100/1000 Mbit/s Ethernet connection (TCP/IP)
  • Fully compatible with standard network infrastructure
  • LEMO connector
  • Optional XCP on Ethernet interface to support third-party calibration and measurement tools

Ethernet real-time I/O interface
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector
  • 100/1000 Mbit/s Ethernet connection (UDP/IPTCP/IP on request)
  • RTI Ethernet (UDP) Blockset (optional) for read/write access
  • LEMO connector

USB interface
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector
  • USB 2.0 interface for long-term data acquisition with USB mass storage devices
  • LEMO connector

CAN interface
  • 4 CAN channels
  • 4 CAN channels
  • 6 CAN channels (partial networking supported)
  • 4 CAN channels
  • 6 CAN channels (partial networking supported)

Serial interface (based on CAN processor)
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 3 x RS232 interface
  • 3 x serial interface usable as K/L-Line or LIN interface
  • 2 x RS232 interface
  • 2 x serial interface usable as K/L-Line or LIN interface
  • 3 x RS232 interface
  • 3 x serial interface usable as K/L-Line or LIN interface

ECU interface
  • 3 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface
  • 2 x dual-port memory interface

IP module slot for FlexRay/CAN FD
  • 2 slots1) for FlexRay2) or CAN FD modules
 – –
  • 2 slots1) for FlexRay2) or CAN FD modules
  • 2 slots1) for FlexRay2) or CAN FD modules
Programmable FPGA – – –
  • Xilinx® Kintex®-7 (XC7K325T)
  • Xilinx® Kintex®-7 (XC7K325T)
Analog input          

Resolution

 –
  • 16 16-bit channels
  • 32 16-bit channels
  • 16 16-bit channels3)
  • 32 16-bit channels3)

Sampling

 –
  • 16 parallel channels with 1 Msps conversion rate
  • 16 independent AD converters with 1 Msps conversion rate and high functionality (diverse trigger options, burst mode, etc. for every channel)

  • 2 independent AD converters with 8 separate sample & hold input channels each. Time synchronous sampling of all 16 channels with 200 Ksps conversion rate in free-running mode.
  • 16 parallel channels with 1 Msps conversion rate
  • 16 independent AD converters with 1 Msps conversion rate and high functionality (diverse trigger options, burst mode, etc. for every channel)

  • 2 independent AD converters with 8 separate sample & hold input channels each. Time synchronous sampling of all 16 channels with 200 Ksps conversion rate in free-running mode.

Input voltage range

 –
  • 0 ... 5 V
  • -10 ... 10 V
  • 0 ... 5 V
  • -10 ... 10 V
Analog output          

Resolution

 –
  • 4 12-bit channels
  • 8 16-bit channels
  • 4 12-bit channels3)
  • 8 16-bit channels3)

Output voltage range

 –
  • 0 ... 4.5 V
  • -10 ... 10 V
  • 0 ... 4.5 V
  • -10 ... 10 V

Output current

 –
  • 5 mA max.
  • 8 mA max.
  • 5 mA max.
  • 8 mA max.
Digital I/O          

General

 – 4)
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements
  • FPGA-based digital I/O
  • RTI software support for bit I/O, frequency, and PWM generation/measurements

Bit I/O

 – 4)
  • 40 inputs
  • 40 outputs, 5 mA output current
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 24 inputs
  • 24 outputs, 5 mA output current

  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 40 inputs3)
  • 40 outputs, 5 mA output current3)
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable
  • 24 inputs3)
  • 24 outputs, 5 mA output current3)
  • Input/output logic levels: 5 V or levels up to 40 V (depending on VDrive), selectable

PWM generation / measurement

 –
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
  • All channels fully configurable as frequency or PWM inputs/outputs
  • PWM frequency 0.0003 Hz ... 150 KHz, duty cycle 0 ... 100%, up to 21-bit resolution
Incremental Encoder interfaces –
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
  • 4 x Encoder interfaces with index support3)
  • Position Count range -2,097,152.0 ... +2,097,151.75 (-221 ... +221-0.25)
  • Configurable noise filter
Onboard sensors
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
  • Motion sensing with 3-axis accelerometer.
  • Pressure sensing for altitude indication.
Signal conditioning
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
  • Signal conditioning for automotive signal levels, no power driver included
  • Overvoltage protection; overcurrent and short circuit protection
Physical connections          
LEMO connectors
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
  • for 2 ECU interfaces, Ethernet I/O interface, USB interface, and Ethernet host interface
Ethernet
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
  • Host interface (100/1000 Mbit/s, TCP/IP) for notebook/PC connection (for program load, experiment configuration, signal monitoring, and flight recorder read-out)
  • Integrated Ethernet switch
Additional connectors
  • 78-pin Sub-D connector
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
  • ZIF connector for I/O signals, mechanically secured, Sub-D connector for power supply
Physical characteristics          
Enclosure Material
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
  • Cast aluminum box
Size
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 50 mm (7.9 x 8.9 x 2.0 in)
  • Approx. 200 x 225 x 95 mm (7.9 x 8.9 x 3.8 in)
  • Approx. 200 x 225 x 95 mm (7.9 x 8.9 x 3.8 in)
Temperature
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
  • Operating (case) temperature: -40 ... +85 °C (-40 ... +185 °F)
  • Storage temperature: -55 ... +125 °C (-67 ... +257 °F)
Power supply
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
  • 6 ... 40 V input power supply, protected against overvoltage and reverse polarity
Power consumption
  • Max. 25 W
  • Max. 25 W
  • Max. 25 W
  • Max. 50 W
  • Max. 50 W

 

1) IP module slot. Can also be used for other IP modules such as ARINC interface modules (via dSPACE Engineering Services).
2) i.e., 4 FlexRay channels, combination with CAN FD possible.
3) Additional channels with DS1552, DS1553, and DS1554.
4) Additional digital I/O channels available via I/O extension on IP module slot (5 inputs and 2 outputs, or 2 inputs and 5 outputs, software-selectable, 5 V output level, 24 mA output current).

1401/1507: Busses and bypassing
1401/1511: Universal high-performance I/O, more digital I/O
1401/1513: Universal high-performance I/O, more analog I/O, more CAN

1401/1511/1514, 1401/1513/1514: Universal high-performance I/O, FPGA/FlexRay/CAN-DP/IP, E-Motor, Cylinder Pressure Indication, I/O Extension
Real-Time Interface (RTI) Implementation of MATLAB®/Simulink®/Stateflow® models on dSPACE hardware MicroAutoBox II Embedded PC Compact and robust PC system for in-vehicle use. Can be used as a stand-alone system or in combination with MicroAutoBox II. ControlDesk ControlDesk is the experiment software for seamless ECU development. It handles all tasks and provides a single working environment. RTI CAN Blockset Connects dSPACE systems with CAN communication networks RTI CAN MultiMessage Blockset Connects dSPACE systems with CAN communication networks Ethernet Blocksets Overview of Ethernet implementation software RTI LIN MultiMessage Blockset Connects dSPACE systems with LIN communication networks dSPACE FlexRay Configuration Package Configuration tool for FlexRay communication systems RTI Bypass Blockset Dialog-based configuration of bypassing applications and real-time ECU access XSG Advanced Engine Control Library FPGA solution for cylinder pressure indication and in-cycle control of combustion engines
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